Multiple die integrated circuit assembly

Details Multiple die integrated circuit assembly Multiple die integrated circuit assembly

2011-08-23

2011-08-23

Milord, Marceau (Department: 2618)

Telecommunications

Transmitter

With feedback of modulated output signal

C455S127400, C455S118000, C455S553100, C455S069000, C455S260000, C455S066100, C375S146000, C375S267000, C370S343000, C370S347000

Reexamination Certificate

active

08005444

ABSTRACT:
An integrated circuit (IC) includes a first die, a second die, a packaging substrate, and coupling circuit. The first die includes first circuitry and the second die includes second circuitry. The packaging substrate supports the first and second dies, wherein the first and second dies are stacked with respect to the packaging substrate. The coupling circuit couples the first die to the second die, wherein the first and second circuitry communicate via the coupling circuit.

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