Multiple contact vertical probe solution enabling Kelvin...

Details Multiple contact vertical probe solution enabling Kelvin... Multiple contact vertical probe solution enabling Kelvin...

2005-06-28

2005-06-28

Tang, Minh N. (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S761010

Reexamination Certificate

active

06911834

ABSTRACT:
Apparatus and methods for testing conductive bumps or target test points on integrated circuits. A multiplicity of probes are extended through a support substrate. At least one of the multiplicity of probe locations include a second electrically isolated probe such that the test point is in contact with two probes. One of the two probes provides a voltage to the test point and the second probe sensing the voltage so as to provide a Kelvin connection.

REFERENCES:
patent: 5982187 (1999-11-01), Tarzwell
patent: 6404213 (2002-06-01), Noda

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