Multiple circuit board module

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

165 803, 165185, 174 163, 357 81, 361388, 361399, H05K 720

Patent

active

049165755

ABSTRACT:
A circuit board module which houses multiple circuit boards. The module includes a thermally conductive frame having a plurality of ribs which extend between the frame side walls. One or more support plates are secured to the frame and support the circuit boards, which contain a plurality of heat generating electronic components. The heat generated by these components is directed through the support plates to the frame for dissipation.

REFERENCES:
patent: 3147402 (1964-09-01), Hochstetler
patent: 3348148 (1967-10-01), Parsons et al.
patent: 4716498 (1987-12-01), Ellis
patent: 4771365 (1988-09-01), Cichocki et al.
Jackson et al, "Heat Transfer Structure For Electronic Subassemblies", IBM Technical Disclosure Bulletin, vol. 13, No. 12, 5/71, pp. 3644-3645.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Multiple circuit board module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multiple circuit board module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multiple circuit board module will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2303222

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.