Multiple circuit board arrangements in electronic devices

Details Multiple circuit board arrangements in electronic devices Multiple circuit board arrangements in electronic devices

2007-01-05

2010-06-01

Levi, Dameon E (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S800000, C361S816000, C174S350000, C174S377000

Reexamination Certificate

active

07729131

ABSTRACT:
Electronic devices can be provided with at least one first circuit component coupled to a first circuit board, at least one second circuit component coupled to a second circuit board, and a mating assembly coupled to the boards for holding them in a vertical stack. The first circuit components can face the second circuit components in the stack. One or more of the first circuit components can be horizontally offset from one or more of the second circuit components in the stack to reduce the thickness of the mated circuit boards. Portions of the circuit boards and the mating assembly can shield the circuit components of the stack from electromagnetic interference.

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International Search Report, issued Jun. 12, 2008 in international application No. PCT/US2008/000213.

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