Multiple-chip semiconductor element in a case of metal and resin

Details Multiple-chip semiconductor element in a case of metal and resin Multiple-chip semiconductor element in a case of metal and resin

1988-07-28

1990-05-08

Davie, James W.

357 74, 357 75, 357 80, 357 81, H01L 2328, H01L 2348

Patent

active

049242962

ABSTRACT:
A multiple-chip semiconducting element in a case of metal and resin consists of a metallic plate, a body of synthetic resin which incorporates a portion of the plate, leaving free a larger surface thereof, and a large number of metallic terminals issuing from the same side of the resin body. Inside the resin body, a first semiconductor element chip is affixed to the metallic plate and a second semiconductor element chip is affixed to a metallic lamina made integral with at least one of the terminals and insulated electrically from the plate.

REFERENCES:
patent: 4542401 (1985-09-01), Sekiba
patent: 4783428 (1988-11-01), Kalfus

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