Multiple-chip probe and universal tester contact assemblage

Details Multiple-chip probe and universal tester contact assemblage Multiple-chip probe and universal tester contact assemblage

2005-11-29

2005-11-29

Nguyen, Vinh P. (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S761010

Reexamination Certificate

active

06970005

ABSTRACT:
A probe card assemblage for simultaneously testing one or more integrated circuit chips including an interposer having on one surface a plurality of protruding contact elements for electrically contacting one or more chips of a wafer positioned atop a layer of compliant material, and arrayed in a pattern corresponding to a chip pads, a series of conductive vias through the electrically insulating interposer which connect the chip contact elements with an arrangement of leads terminating in a universal arrangement of connectors on the second surface, and a probe card with connectors mating to those on the interposer. The connectors on the interposer is secured are secured to those on the probe card, thereby providing a vertical probe assemblage which makes use of ultrasonic energy to minimize scrub or over travel. The universal probe card is specific to a tester configuration and common to a family of circuits to be tested.

REFERENCES:
patent: 6215320 (2001-04-01), Parrish
patent: 6218910 (2001-04-01), Miller
patent: 6799976 (2004-10-01), Mok et al.

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