Multiple chip package with thinned semiconductor chips

Details Multiple chip package with thinned semiconductor chips Multiple chip package with thinned semiconductor chips

1992-06-15

1993-12-28

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437211, 437217, 437220, 437225, 437974, H01L 2160

Patent

active

052739406

ABSTRACT:
An assembly is formed by coupling a plurality of semiconductor chips (26-29) to a surface of a substrate (17). An encapsulation material (22) is placed on the surface of the substrate (17) to protect the semiconductor chips (26-29) from an external environment. Material is removed from the plurality of semiconductor chips (26-29) to thin each semiconductor chip (26-29) to promote thermal conductivity.

REFERENCES:
patent: 4432131 (1984-02-01), Sadamasa et al.
patent: 4530152 (1985-07-01), Roche et al.
patent: 4635356 (1987-01-01), Ohuchi et al.
patent: 4999319 (1991-03-01), Hamano et al.
patent: 5001075 (1991-03-01), Boland et al.
patent: 5081067 (1992-09-01), Shimizu et al.
patent: 5155068 (1992-10-01), Tada

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