Multiple chip module with integrated RF capabilities

Details Multiple chip module with integrated RF capabilities Multiple chip module with integrated RF capabilities

2005-04-26

2005-04-26

Trinh, Michael (Department: 2822)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S761000, C361S763000, C361S803000, C361S816000, C361S818000, C174S034000, C174S260000, C174S261000

Reexamination Certificate

active

06885561

ABSTRACT:
A multiple chip module (MCM) for use with baseband, RF, or IF applications includes a number of active circuit chips having a plurality of different functions. The active circuit chips are mounted on a substrate that is configured to provide an integrated subsystem in a single MCM package. The MCM includes a number of features that enable it to meet electrical performance, high-volume manufacturing, and low-cost requirements. The MCM may incorporate split ground planes to achieve electronic shielding and isolation, vias configured as both thermal sinks and grounding connections, and specifically configured die attach pads and exposed ground conductor pads.

REFERENCES:
patent: 4446477 (1984-05-01), Currie et al.
patent: 4792773 (1988-12-01), Bert et al.
patent: 5608261 (1997-03-01), Bhattacharyya et al.
patent: 5652466 (1997-07-01), Hirakawa et al.
patent: 5719750 (1998-02-01), Iwane
patent: 5818699 (1998-10-01), Fukuoka
patent: 6153290 (2000-11-01), Sunahara
patent: 6356333 (2002-03-01), Uchiyama
patent: 20040070024 (2004-04-01), Momose et al.

Affiliated with

Also associated with

Rating

Multiple chip module with integrated RF capabilities does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multiple chip module with integrated RF capabilities, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multiple chip module with integrated RF capabilities will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3442118