Multiple board package employing solder balis and fabrication me

Details Multiple board package employing solder balis and fabrication me Multiple board package employing solder balis and fabrication me

1997-06-09

2000-03-28

Ryan, Patrick

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361790, 228 62, 228 447, 22818022, 228212, B23K 3102, B23K 3704, H05K 111

Patent

active

060439904

ABSTRACT:
A multiple circuit board package employing solder balls and method and apparatus for fabricating same is described. Two or more printed circuit boards and a plurality of electronic devices are joined together using solder balls. Alternatively, three or more printed circuit boards are joined together using the solder balls. A novel and improved solder ball connection is disclosed, along with a fixture for aligning and fixing the disposition of the pads and the solder balls during a heating cycle in which the circuit boards are placed under pressure while the solder balls are re-flowed for making an electrical connection.

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