Electric heating – Metal heating – By arc
Reexamination Certificate
2003-09-02
2009-12-08
Elve, M. Alexandra (Department: 3742)
Electric heating
Metal heating
By arc
C219S121730
Reexamination Certificate
active
07629555
ABSTRACT:
A system for delivering energy to a substrate including a dynamically directable source of radiant energy providing a plurality of beams of radiation, each propagating in a dynamically selectable direction. Independently positionable beam steering elements in a plurality of beam steering elements are operative to receive the beams and direct them to selectable locations on the substrate.
REFERENCES:
patent: 3594081 (1971-07-01), Tschink
patent: 4038108 (1977-07-01), Engel et al.
patent: 4060322 (1977-11-01), Hirayama et al.
patent: 4258468 (1981-03-01), Balde
patent: 4279472 (1981-07-01), Street
patent: 4447291 (1984-05-01), Schulte
patent: 4602852 (1986-07-01), Moroz
patent: 4784449 (1988-11-01), Auracher et al.
patent: 4833681 (1989-05-01), Akiyama et al.
patent: 4838631 (1989-06-01), Chande et al.
patent: 4950862 (1990-08-01), Kajikawa
patent: 5055653 (1991-10-01), Funami et al.
patent: 5113055 (1992-05-01), Kuriyama
patent: 5302798 (1994-04-01), Inagawa et al.
patent: 5309178 (1994-05-01), Gross
patent: 5404247 (1995-04-01), Cobb et al.
patent: 5408553 (1995-04-01), English, Jr. et al.
patent: 5475416 (1995-12-01), Kessler et al.
patent: 5585019 (1996-12-01), Gu et al.
patent: 5593606 (1997-01-01), Owen et al.
patent: 5614114 (1997-03-01), Owen
patent: 5674414 (1997-10-01), Schweizer
patent: 5676866 (1997-10-01), In den Baumen et al.
patent: 5690845 (1997-11-01), Fuse
patent: 5789121 (1998-08-01), Cywar et al.
patent: 5837962 (1998-11-01), Overbeck
patent: 5841099 (1998-11-01), Owen et al.
patent: 5933216 (1999-08-01), Dunn
patent: 5942136 (1999-08-01), Mori et al.
patent: 5948288 (1999-09-01), Treves et al.
patent: 5948291 (1999-09-01), Neylan et al.
patent: 5969877 (1999-10-01), Maeda
patent: 5973290 (1999-10-01), Noddin
patent: 6011654 (2000-01-01), Schweizer et al.
patent: 6037564 (2000-03-01), Tatah
patent: 6037968 (2000-03-01), Emge et al.
patent: 6040552 (2000-03-01), Jain et al.
patent: 6058132 (2000-05-01), Iso et al.
patent: 6172331 (2001-01-01), Chen
patent: 6184490 (2001-02-01), Schweizer
patent: 6233044 (2001-05-01), Brueck et al.
patent: 6252667 (2001-06-01), Hill et al.
patent: 6275514 (2001-08-01), Katzir et al.
patent: 6295171 (2001-09-01), Chao et al.
patent: 6310701 (2001-10-01), Lizotte et al.
patent: 6313918 (2001-11-01), Hill et al.
patent: 6329634 (2001-12-01), Schweizer
patent: 6376799 (2002-04-01), Amako et al.
patent: 6420675 (2002-07-01), Lizotte et al.
patent: 6423935 (2002-07-01), Hackel et al.
patent: 6452132 (2002-09-01), Fuse
patent: 6462306 (2002-10-01), Kitai et al.
patent: 6462307 (2002-10-01), Hennig et al.
patent: 6480334 (2002-11-01), Farn
patent: 6491361 (2002-12-01), Spann
patent: 6515257 (2003-02-01), Jain et al.
patent: 6521866 (2003-02-01), Arai et al.
patent: 6566627 (2003-05-01), Brandinger et al.
patent: 6605796 (2003-08-01), Brandinger et al.
patent: 6674564 (2004-01-01), Vernackt et al.
patent: 6800237 (2004-10-01), Yamamoto et al.
patent: 6972392 (2005-12-01), Kurosawa et al.
patent: 2001/0030176 (2001-10-01), Sun et al.
patent: 2001/0045690 (2001-11-01), Brandinger
patent: 2002/0166845 (2002-11-01), Cordingley et al.
patent: 19801364 (1999-07-01), None
patent: 0683007 (1995-11-01), None
patent: 1095726 (2000-07-01), None
patent: 1095726 (2001-05-01), None
patent: 1224999 (2002-07-01), None
patent: 1049559 (2003-11-01), None
patent: 55081095 (1980-06-01), None
patent: 8047789 (1990-02-01), None
patent: 10229266 (1998-08-01), None
patent: 1996-0033636 (1996-10-01), None
patent: 1997-0033388 (1997-07-01), None
patent: WO 00/64623 (2000-11-01), None
Mignardi et al., “The Digital Micromirror Device-a Micro-Optical Electromechanical Device for Display Applications”, MEMS and MOEMS Technology and Applications; SPIE Press, 2000.
Owen, Mark, New Technology for Drilling Through-and Blind-Vias in Copper Clad Reinforced Circuit Boards, IPC Proceedings, May 1995.
Lee and Moreno, Excimer vs. ND:YAG Laser Creation of Silicon Vias for 3D Interconnects, IEEE, 1992, pp. 358-360.
“Dopant-Induced Excimer Laser Ablation of Poly(tetrafluoroethylene),” Applied Physics B:Photo-Physics and Laser Chemistry, Mar. 1992, vol. b54, No. 3, C R Davis et al, pp. 227-230.
“Etch-Stop Polymer Machining with an Argon Ion Laser,” IBM Technical Disclosure Bulletin, Jan. 1993, vol. 36, No. 1, Armonk, NY, US, p. 254.
Pete Singer, “The Interconnect Challenge: Filling Small, High Aspects Ratio Contact Holes,” Semiconductor International, Aug. 1994, pp. 57-64.
“Printed Circuit Operations—A View from Inside,” Unisys.
Richard Harris et al., “MCM Micromachining: Nd:YAG UV Laser Process is a New Option,” Electro Scientific Industries, Inc., Spring 1993.
“LaserPulse,” Electro Scientific Industries, Inc., Fall 1993, pp. 1-7.
Y. S. Liu, “Laser Metal Deposition for High-Density Interconnect,” Optics & Photonics News, Jun. 1992, pp. 10-14.
Friedrich G. Bachmann, “Large scale industrial application for excimer-lasers; via-hole-drilling by Photo-ablation,” SPIE, vol. 1361, Physical Concepts of Materials for Novel Optoelectronic Device Applications, 1990, pp. 500-511.
Hans-Ulrich Krebs and Olaf Bremert “Pulsed laser deposition of thin metallic alloys”, Applied Physics Letters vol. 62(19) pp. 2341-2343. May 10, 1993.
Brannon, J.H., “Excimer-Laser Ablation and Etching,” Circuits & Devices magazine, Sep. 1990 pp. 19-24.
Cole, H.S., Liu, Y.S., and Philipp, H.R., “Dependence of photoetching rates of polymers at 193 nm on optical absorption depth,” Appl. Phys. Lett., vol. 48, No. 1, Jan. 6, 1986, pp. 76-77.
Dyer, P.E., and Sidhu, J., “Spectroscopic and fast photographic studies of excimer laser polymer ablation,” J. Appl. Phys. 64 (9), Nov. 1, 1988, pp. 4657-4663.
4420 Laser Micromachining System-ESI Brochure (2 pages), Sep. 1993.
Ewing, J.J., “Advanced solid-state lasers challenge conventional types,” Laser Focus World, Nov. 1993, pp. 105-110.
Hobbs, Jerry R., “Electronics makers switch to precise micromachining tools,” Laser Focus World, Mar. 1994, pp. 69-72.
Lee, Rex A. and Moreno, W .A., Excimer vs. ND:YAG Laser Creation of Silicon Vias for 3D Interconnects, IEEE, 1992, pp. 358-360.
Liu, Y.S., Cole, H.S., and Guida, R., “Laser ablation of polymers for high-density interconnect,” Microelectronic Engineering 20 (1993) 15-29, 1993 Elsevier Science Publishing B.V., pp. 15-29.
Mahan, G.D., et al. “Theory of polymer ablation,” Appl. Phys. Lett. 53 (24), Dec. 12, 1988, pp. 2377-2379.
Owen, Mark, New Technology for Drilling Through -and Blind-Vias in Copper Clad Reinforced Circuit Boards, IPC Proceedings, May 1995.
Srinivasan, R., and Braren R., “Ultraviolet Laser Ablation of Organic Polymers,” Chemical Reviews, 1989, vol. 89, No. 6.
Tessier, Theodore G. and Chandler, Jerry, “Compatibility of Common MCM-D Dielectric with Scanning Laser Ablation Via Generation Processes,” IEEE (1993), pp. 39-45.
“Trepanning Moves in on Mini Holes,” Machinery and Production Engineering, Nov. 2, 1983, pp. 42-43.
Wiener-Avnear, Eli “Lasers cut microscopic paths with major potential,” Laser Focus World, Jul. 1993, pp. 75-80.
Wu et al., “Single-Shot Excimer Laser Ablation of Thick Polymar Desists on Metallic Substrates,” AMP Journal of Technology, vol. 1, Nov. 1991, pp. 69-79.
Martyniuk J., “UV Laser-Assisted Wire Strippping amd Micromachining”, AMP Journal of Technology, vol. 4, Jun. 1995.
“Laser-Induced Plated Through-Holes,” IBM Technical, Disclosure Bulletin, Oct. 1968, vol. 11, No. 5, H.R. Potts and C.A. Speicher, p. 540.
ESI “Model 4570 Series Lasers Service Guide”, Feb. 1994.
Gross Abraham
Kotler Zvi
Lipman Eliezer
Elve M. Alexandra
Orbotech Ltd
Sughrue & Mion, PLLC
LandOfFree
Multiple beam micro-machining system and method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Multiple beam micro-machining system and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multiple beam micro-machining system and method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4097369