Multiple-ball wire bonds

Details Multiple-ball wire bonds Multiple-ball wire bonds

2006-06-20

2006-06-20

Cao, Phat X. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S738000

Reexamination Certificate

active

07064433

ABSTRACT:
The invention provides a wire bond comprising multiple ball bonds and a method of forming the wire bond to bond a wire to a connection pad of an electronic device. The wire bond comprises a first bump ball formed on the connection pad and a second bump ball formed on the connection pad that is contiguous with the first bump ball.

REFERENCES:
patent: 6429028 (2002-08-01), Young et al.
patent: 6583483 (2003-06-01), Masumoto et al.
patent: 6864587 (2005-03-01), Shibata

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