Multimold semiconductor device and the manufacturing method ther

Details Multimold semiconductor device and the manufacturing method ther Multimold semiconductor device and the manufacturing method ther

1990-09-11

1991-10-15

Hille, Rolf

Fishing, trapping, and vermin destroying

437211, 357 72, H01L 2148, H01L 2156

Patent

active

050574574

ABSTRACT:
In multimold semiconductor devices, semiconductor chips are mounted on a lead frame and bonded with wire, sealed by an inner resin, and further enclosed by an outer resin. In particular, wax to be added to the inner resin is at least one compound selected from the group consisting of ester group, fatty acid based, fatty acid metallic salt based, fatty alcohol, polyhydric alcohol, and fatty acid amide compounds. In the semiconductor devices sealed by the inner resin including wax thus defined, since the adhesion strength between the inner and outer resins can be increased, peeling resistance between the two and the moisture resistance can be improved markedly and cracks after dip soldering can be perfectly eliminated, without effecting any conventional inner resin treatment such as honing, burning, after-curing, etc.

REFERENCES:
patent: 3762039 (1973-10-01), Douglass et al.
patent: 4250347 (1981-02-01), Fierkens

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