Multilevel metallization method for fabricating a metal oxide se

Chemistry: electrical and wave energy – Processes and products – Vacuum arc discharge coating

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C23C 1500

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041117751

ABSTRACT:
An improved method of constructing a metal oxide semiconductor (MOS) device having multiple layers of metal deposited by D.C. magnetron sputtering at low D.C. voltages and low substrate temperatures provides multilevel interconnections and cross over between individual circuit elements in integrated circuits without significantly reducing the reliability or seriously affecting the yield.

REFERENCES:
patent: 3804738 (1974-04-01), Lechaton et al.
F. Barson et al., "Hillock Suppression in Aluminum Thin Films", IBM Tech. Disc. Bull., vol. 13, p. 1122 (1970).
P. S. McLeod et al., "High-Rate Sputtering of Aluminum for Metallization of Integrated Circuits", J. Vac. Sci. Tech., vol. 14, pp. 263-265 (1977).
A. Aronson et al., "Inline Production Magnetron Sputtering", Vacuum, vol. 27, pp. 151-153 (1977).

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