Multilevel leadframe for a packaged integrated circuit

Details Multilevel leadframe for a packaged integrated circuit Multilevel leadframe for a packaged integrated circuit

1998-05-05

2000-05-23

Monin, Jr., Donald L.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438106, 257666, 257669, 257691, 257692, H01L 2348

Patent

active

060665157

ABSTRACT:
The present invention is directed to a packaged semiconductor chip that utilizes a multilevel leadframe that positions the lead fingers close to the bond pads while positioning the bus bars on a different level and behind or outboard of the lead finger connections such that it is unnecessary for any wires to cross over the bus bars or the lead fingers. The leadframe may comprise a multi-part frame, or be fabricated from a single sheet of metal.

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