Metal working – Method of mechanical manufacture – Electrical device making
Patent
1996-12-18
1999-09-07
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
29830, H01K 310
Patent
active
059467991
ABSTRACT:
In a multilevel interconnect structure for use in a semiconductor device including a lower metal wiring having an aluminum or aluminum alloy film and a high melting point metal or high melting metal alloy film, an interlayer insulating film deposited on the lower metal wiring, a via hole formed in the interlayer insulating film, a plug made of aluminum or aluminum alloy and formed in the via hole, and an upper metal wiring having an aluminum or aluminum alloy film and a high melting point metal or high melting point metal alloy film, said plug is directly contacted with the aluminum or aluminum alloy film of at least one of the lower and upper metal wirings to decrease the via resistance without reducing the electromigration reliability. The plug is formed such that its top portion protrudes from the interlayer insulating film, the high melting point metal or high melting point metal alloy film of the upper metal wiring is formed, and then the top portion of the plug is removed together with a part of the high melting point metal or high melting point metal alloy film by a chemical mechanical polishing to expose an upper end of the plug. Then, the aluminum or aluminum alloy film of the upper metal wiring is formed to be brought into direct contact with the plug.
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Ohta Tomohiro
Takeyasu Nobuyuki
Yamamoto Hiroshi
Arbes Carl J.
Kawasaki Steel Corporation
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