Multilayered wiring board having printed inductor

Details Multilayered wiring board having printed inductor Multilayered wiring board having printed inductor

1993-02-24

1994-12-13

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174250, 336200, 361794, 361792, H05K 102, H01F 500

Patent

active

053731123

ABSTRACT:
A multilayered wiring board having a printed inductor which is formed on a grounding layer or electric power supply layer through a dielectric layer inserted between them, wherein a removed portion is formed only in the grounding layer or electric power supply layer which is positioned right under the printed inductor and in the neighboring area and no removed portion is formed in the dielectric layer. According to this structure, without increasing the manufacture cost, the distance between the printed inductor and the grounding layer or electric power supply layer opposite to it spreads to the lower electric power supply layer or grounding layer and the stray capacity existing therebetween is reduced, and a reduction of the self-resonance frequency of the printed inductor is prevented, and the frequency characteristics improve.

REFERENCES:
patent: 4117438 (1978-09-01), Kim et al.
patent: 5012047 (1991-04-01), Dohya

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