Multilayered substrate and method for its production

Details Multilayered substrate and method for its production Multilayered substrate and method for its production

1999-09-17

2000-09-05

Thomas, Alexander S.

Stock material or miscellaneous articles

Sheet, web, or layer weakened to permit separation through...

428136, 428137, 156252, 156253, B32B 310

Patent

active

061139998

ABSTRACT:
A multilayered substrate divisible into a plurality of parts at predetermined positions of division is configured such that intermittently formed perforation-like holes or slit-like holes are present at the positions of division of a core layer. Further, V-cut V-grooves are present at the positions of division of surface layers. The multilayered substrate, divisible at predetermined positions of division, is also configured such that first intermittently formed holes (perforation-like holes, slit-like holes, or widely spaced holes) are present at the positions of division of the core layer. Further, second intermittently formed holes (perforation-like holes, or slit-like holes) are present at the positions of division of the surface layers so as to pass through the multilayered substrate. At the positions of division of the core layer, each of the second holes is located between the adjacent first holes, whereby the first holes and the second holes are continuous with each other. Methods for production of these multilayered substrates are also disclosed.

REFERENCES:
patent: 3823057 (1974-07-01), Roberts et al.
patent: 4368903 (1983-01-01), Jones
patent: 5789050 (1998-08-01), Kang

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