Multilayered printed wiring board and method of manufacturing th

Details Multilayered printed wiring board and method of manufacturing th Multilayered printed wiring board and method of manufacturing th

1993-11-30

1995-10-03

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174260, 361760, 361767, 361792, 361794, H05K 100

Patent

active

054553938

ABSTRACT:
A multilayered printed wiring board includes a plurality of inner layer circuits, ground layers, first insulating layers, a second insulating layer, a surface layer circuit, and a parts mounting pad. The inner layer circuits are arranged parallel to each other in a flat manner in at least one inner layer. The ground layers are formed on and under the inner layer circuits to sandwich the inner layer circuits. The first insulating layers are respectively formed between the ground layers and the inner layer circuits to insulate the inner layer circuits from each other and the inner layer circuits from the ground layers. The second insulating layer is formed at least on an uppermost one of the ground layers and serving as a surface layer. The surface layer circuit is selectively formed on the second insulating layer. The parts mounting pad is formed at a predetermined region on the second insulating layer, has a recessed portion for fitting a lead portion of a mounting part therein, and is connected to the surface layer circuit. A method of manufacturing this printed wiring board is also disclosed.

REFERENCES:
patent: 4706167 (1987-11-01), Sullivan
patent: 4893216 (1990-01-01), Hagner
patent: 5061824 (1991-10-01), Alexander et al.
patent: 5136471 (1992-08-01), Inasaka
patent: 5313021 (1994-05-01), Sajja et al.
patent: 5320894 (1994-06-01), Hasegawa

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