Multilayered printed circuit board, solder resist...

Details Multilayered printed circuit board, solder resist... Multilayered printed circuit board, solder resist...

2011-03-22

2011-03-22

Dinh, Tuan T (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S257000, C174S258000

Reexamination Certificate

active

07910836

ABSTRACT:
The present invention is to provide a multilayered printed circuit board free from cracks attributed to thermal expansion difference between a solder resist layer and another part and a multilayered printed circuit board of the present invention comprises a conductor circuit and a resin insulating layer serially formed on a substrate in an alternate fashion and in repetition and a solder resist layer formed as an outermost layer, and the solder resist layer contains an inorganic filler.

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