Multilayered power supply line for semiconductor integrated...

Details Multilayered power supply line for semiconductor integrated... Multilayered power supply line for semiconductor integrated...

2007-11-06

2007-11-06

Reichard, Dean A. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S311000, C361S761000

Reexamination Certificate

active

10812962

ABSTRACT:
The present invention provides a multilayered power supply line suitable for use in a semiconductor integrated circuit and a layout method thereof. In the multilayered power supply line (10) for the semiconductor integrated circuit, a top metal (12) and a second metal (14) are electrically connected to each other by through holes (18). Further, a capacitor metal (16) is electrically connected to the top metal (12) by through holes (20) to thereby make the top metal (12), the second metal (14) and the capacitor metal (16) identical in potential to one another, whereby the multilayered power supply line functions as a power supply line based on normal wiring metals without functioning as a capacitor. It is thus possible to supply power with reduced impedance.

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patent: 6646860 (2003-11-01), Takaramoto et al.
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patent: 7009832 (2006-03-01), Chen et al.
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patent: 2003/0206389 (2003-11-01), Hajimiri et al.
patent: 09-246476 (1997-09-01), None
patent: 2000-311964 (2000-11-01), None

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