Multilayered polymeric structure

Details Multilayered polymeric structure Multilayered polymeric structure

2005-09-27

2005-09-27

Tsoy, Elena (Department: 1762)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S163000, C156S244110, C264S173160, C264S176100, C264S328800, C427S407100

Reexamination Certificate

active

06949159

ABSTRACT:
A multilayered polymeric structure having at least two polymeric layers is provided, each layer being a mixture of a polymeric composition with carbon fibrils. The multilayer polymeric structure may include an electrically conductive material between the first and second polymeric layers. A process for making a multilayered polymeric structure for packaging electronic components is also provided. The multilayered polymeric material is used to form trays and packages for containing electrical components.

REFERENCES:
patent: 4414260 (1983-11-01), Rzepecki et al.
patent: 5591382 (1997-01-01), Nahass et al.

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