Multilayered pellet and molded resin

Details Multilayered pellet and molded resin Multilayered pellet and molded resin

2011-01-25

2011-01-25

Shosho, Callie E (Department: 1787)

Stock material or miscellaneous articles

Coated or structually defined flake, particle, cell, strand,...

Particulate matter

C428S403000, C525S056000, C525S178000, C525S421000, C525S426000, C525S420000, C523S201000

Reexamination Certificate

active

07875353

ABSTRACT:
Multilayered pellets are provided that contain an ethylene-vinyl alcohol copolymer (EVOH) and a polyamide resin and that have excellent thermal stability during pelletizing and melt molding. The multilayered pellets each are composed of at least two resin layers and include a resin layer A whose main component is EVOH and a resin layer B whose main component is a polyamide resin. In the multilayered pellets, at least 70 mol % of all the terminals of the polyamide resin are blocked by units each containing an imide structure.

REFERENCES:
patent: 6110549 (2000-08-01), Hamada et al.
patent: 6297345 (2001-10-01), Okushita et al.
patent: 7534829 (2009-05-01), Tai et al.
patent: 2005/0009987 (2005-01-01), Hara et al.
patent: 2005/0027053 (2005-02-01), Uchiumi et al.
patent: 59-81121 (1984-05-01), None
patent: 4 114060 (1992-04-01), None
patent: 4-114060 (1992-04-01), None
patent: 2001-302806 (2001-10-01), None
patent: 2001 302806 (2001-10-01), None
patent: 2002 332360 (2002-11-01), None
patent: 2002-332360 (2002-11-01), None
patent: WO 03072653 (2003-09-01), None
English Abstract of DE 3921210, Bernhard, Jul. 1990.
Machine Translation of DE 3922120 C1 (1989).

Affiliated with

Also associated with

Rating

Multilayered pellet and molded resin does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayered pellet and molded resin, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayered pellet and molded resin will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2705854