Multilayered metallic printed board and molded module

Details Multilayered metallic printed board and molded module Multilayered metallic printed board and molded module

1996-12-03

1998-06-23

Ryan, Patrick

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428901, 174250, 174255, 174257, 174258, 174260, 174261, 174254, 361749, 361784, B32B 300, H05K 100, H05K 103, H05K 111

Patent

active

057703000

ABSTRACT:
A metallic printed board is formed by laminating an insulation layer on the surface of a metallic sheet as a base, and then electronic parts are mounted on the conductor pattern formed on the surface of the insulation layer. A double-sided printed board mounted thereon electronic parts is placed in parallel. Both the printed boards are supported and fixed monolithically by filling the space between the printed boards with an insulation resin and curing the resin. Furthermore, an insulation resin is laminated on the surface of the printed board in such a manner that the resin may cover the mounted electronic parts, and cured. The heat generated from the electronic parts can be efficiently transmitted to the insulation resins by using a resin having a high thermal conductivity for both of the insulation resins, and the heat is then emitted from the surfaces of the metallic sheet or the insulation resin.

REFERENCES:
patent: 4584767 (1986-04-01), Gregory
patent: 5290971 (1994-03-01), Hamaguchi
Microelectronic Manufacturing & Testing Desk Manual 1985, pp. 183-184.

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