Multilayered interposer board for powering high current chip mod

Details Multilayered interposer board for powering high current chip mod Multilayered interposer board for powering high current chip mod

1986-03-10

1987-08-18

Tolin, G. P.

Electricity: electrical systems and devices

Miscellaneous

361407, 361412, 361414, 439 68, H05K 500

Patent

active

046881514

ABSTRACT:
A multilayered interposer powering board is disclosed for the distribution of required voltage levels to integrated circuit chip modules under conditions of high current demand and heat induced expansions. The interposer board is introduced between the module and its module mounting board. Flexible connector fingers are intermetallically or ohmically connected between a given level of the interposer board and a given power level of the module.

REFERENCES:
patent: 2740097 (1956-03-01), Edelman
patent: 3072874 (1963-01-01), Roney
patent: 4054939 (1977-10-01), Ammon
patent: 4150421 (1979-04-01), Nishihara
patent: 4322778 (1982-03-01), Barbour
IBM Technical Disclosure Bulletin, vol. 24, No. 9, Feb. 1982, "Bus for Breadboards" by M. A. Schappert, pp. 4488-4489.

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