Coating processes – Nonuniform coating – Mask or stencil utilized
Reexamination Certificate
2011-08-30
2011-08-30
Yuan, Dah-Wei D (Department: 1712)
Coating processes
Nonuniform coating
Mask or stencil utilized
C427S256000, C427S258000, C427S260000, C427S287000, C427S162000, C427S164000, C427S165000, C427S166000, C427S402000, C427S407100, C427S407200, C427S487000, C427S508000, C118S256000, C118S258000, C118S261000, C118S407000, C118S412000, C118S200000, C118S100000, C118S104000, C118S203000, C118S400000, C118S406000
Reexamination Certificate
active
08007867
ABSTRACT:
The present invention provides a method for manufacturing a multilayer information recording medium including at least two information recording portions and a resin layer interposed between the information recording portions, both of which are disposed on a signal substrate. The method includes a first process of forming a predetermined information recording portion on one principal surface of the signal substrate and a second process of passing a part of a resin-containing coating, which is supplied on a screen having an application region with a plurality of first pores and a removal region with a plurality of second pores, through the first pores by sliding a squeegee on the screen so as to form a coating layer on the predetermined information recording portion, and curing the resin contained in the coating layer so as to form the resin layer. The first process and the second process are carried out respectively a predetermined number of times. In each second process, at least a part of the resin-containing coating that has not been applied on the predetermined information recording portion and that remains on the screen is allowed to pass through the second pores so as to be removed from the screen surface.
REFERENCES:
patent: 5197384 (1993-03-01), Yawata et al.
patent: 5202171 (1993-04-01), Anezaki et al.
patent: 5312663 (1994-05-01), Kosinski et al.
patent: 5336531 (1994-08-01), Nakayama et al.
patent: RE35947 (1998-11-01), Kosinski et al.
patent: 6103795 (2000-08-01), Leugs et al.
patent: 6136133 (2000-10-01), Maruyama et al.
patent: 6270611 (2001-08-01), Ohki et al.
patent: 6676791 (2004-01-01), Kondo et al.
patent: 2001/0043555 (2001-11-01), Hisada et al.
patent: 2001/0053122 (2001-12-01), Yukumoto et al.
patent: 2002/0011299 (2002-01-01), Miyamoto et al.
patent: 2002/0031632 (2002-03-01), Hisada et al.
patent: 2002/0057645 (2002-05-01), Kishima
patent: 2003/0099770 (2003-05-01), Hayashi et al.
patent: 2003/0199655 (2003-10-01), Yurugi et al.
patent: 2004/0004300 (2004-01-01), Yamaguchi et al.
patent: 2004/0027974 (2004-02-01), Hisada et al.
patent: 2004/0232570 (2004-11-01), Hayashi et al.
patent: 2006/0018242 (2006-01-01), Tomiyama et al.
patent: 2006/0182890 (2006-08-01), Takahashi et al.
patent: 2006/0188653 (2006-08-01), Takahashi et al.
patent: 1157724 (2004-07-01), None
patent: 0 443 522 (1991-08-01), None
patent: 1 296 319 (2003-03-01), None
patent: 1 403 861 (2004-03-01), None
patent: 1 571 659 (2005-09-01), None
patent: 1 669 991 (2006-06-01), None
patent: 3-225643 (1991-04-01), None
patent: 3-205628 (1991-09-01), None
patent: 4-363649 (1992-12-01), None
patent: 8-167178 (1996-06-01), None
patent: 9-035336 (1997-02-01), None
patent: 11-102542 (1999-04-01), None
patent: 11-300941 (1999-11-01), None
patent: 2000-3531 (2000-01-01), None
patent: 2000-30312 (2000-01-01), None
patent: 2002-92969 (2002-03-01), None
patent: 2004-005836 (2004-01-01), None
patent: 2004-130557 (2004-04-01), None
Nishikiori Keiji
Tomekawa Yuuko
Tomiyama Morio
Hamre Schumann Mueller & Larson P.C.
Jiang Lisha
Panasonic Corporation
Yuan Dah-Wei D
LandOfFree
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