Multilayered glass-ceramic substrate for mounting of semiconduct

Metal working – Method of mechanical manufacture – Electrical device making

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29848, 65 33, 65 60A, 65 60C, H05K 310, H05K 338, H05K 346

Patent

active

042210470

ABSTRACT:
A method for fabricating an interconnection package for a plurality of semiconductor chips which include the fabrication of a multi-layered glass-ceramic superstructure with a multi-layered distribution of conductors on a preformed multi-layered glass-ceramic base, by the repeatable steps of depositing a conductor pattern on the base and forming thereon a crystallizable glass dielectric layer which is then crystallized to a glass-ceramic prior to further additions of conductor patterns and crystallizable glass layers to form a monolithic compatible substrate all through. Semiconductor chips can be electrically connected to expose conductor patterns at the top surface of the resultant glass-ceramic package.

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