Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2000-05-20
2001-10-09
Picard, Leo P. (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S719000, C361S715000, C257S713000
Reexamination Certificate
active
06301114
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to a multilayered electronic part or component and an electronic circuit module including therein the multilayered electronic part or component.
DESCRIPTION OF THE PRIOR ART
A common electronic circuit module and a multilayered electronic component included therein have been disclosed in Japanese Laid-open Application No. 94-112090. This electronic circuit module is employed as one of function blocks such as a DC-DC converting block in such a way that a chip including an inherent electronic circuit which is formed with passive devices, e.g., resistor(s), and/or active devices, e.g., transistor(s) and IC(s), is integrated on the multilayered electronic component having a multilayered inductor and a multilayered capacitor. The multilayered electronic component has a first surface, a second opposite surface and side surfaces, wherein external electrodes are formed on the side surfaces and the chip is attached to the first surface, in such a way that when the electronic circuit module is mounted onto a circuit board, the second opposite surface of the multilayered electronic component will face the circuit board.
A method for manufacturing the multilayered electronic component begins with a process for forming internal electrode patterns made of a conductive paste on dielectric ceramic sheets. At the same time, another internal electrode patterns made of a conductive paste are formed on ferrite sheets after making through-holes on the ferrite sheets. Then, the dielectric ceramic sheets and the ferrite sheets are piled up to form multilayered stacks, respectively. Finally, the multilayered stacks are sintered to form the multilayered electronic components, e.g., a multilayered capacitor and a multilayered inductor.
Considering the above electronic circuit module in view of its thermal radiation, it is difficult to realize a miniaturization of the electronic circuit module. In the electronic circuit module having a common size, a thermolytic effect of the electronic circuit module is achieved by forming an additional radiation fin in the active device, e.g., transistor. Accordingly, if the electronic circuit module is miniaturized, it is difficult to satisfactorily getting rid of the heat induced in each components, e.g., transistor and so on. In other words, the formation of the additional radiation fin impedes the miniaturization of the electronic circuit module and, on the other hand, the miniaturization thereof without any additional thermal radiation component will result in the insufficient thermal radiation.
SUMMARY OF THE INVENTION
It is, therefore, a primary object of the invention to provide a multilayered electronic component with improved thermolytic effect.
It is another objection of the invention to provide an electronic circuit module with the multilayered electronic component having improved thermolytic effect, thereby facilitating the realization of the miniaturization of the electronic circuit module.
In accordance with one aspect of the present invention, there is provided with a multilayered electronic component having a first top surface, the multilayered electronic component comprising: a plurality of insulating sheets and a plurality of conducting patterns, wherein the insulating sheets and the conducting patterns are alternately piled up on top of each other; at least one land formed on the first top surface thereof, for connecting the multilayered electronic component to another electronic component; a heat dissipation pattern formed in the multilayered electronic component in a vicinity of the first top surface thereof; and at least one external electrode for connecting the multilayered electronic component to a circuit board, wherein the heat dissipation pattern is electrically connected to the land as well as the external electrode.
In accordance with another aspect of the present invention, there is provided with an electronic circuit module, the electronic circuit module comprising: a multilayered electronic component including a plurality of insulating sheets and a plurality of conducting patterns, at least one land formed on a first top surface thereof, a heat dissipation pattern formed in the multilayered electronic component in a vicinity of the first top surface thereof, and at least one external electrode for connecting the multilayered electronic component to a circuit board, wherein the insulating sheets and the conducting patterns are alternately piled up on top of each other and the heat dissipation pattern is electrically connected to the land as well as the external electrode; and an exothermic electronic component mounted on the multilayered electronic component, wherein the exothermic electronic component is connected to the multilayered electronic component through the land.
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Chervinsky Boris L.
Picard Leo P.
Rosenman & Colin LLP
Taiyo Yuden Co.,Ltd.
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