Multilayered electronic component

Details Multilayered electronic component Multilayered electronic component

2008-05-20

2008-05-20

Dinh, Tuan T (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S760000, C361S766000, C336S200000

Reexamination Certificate

active

07375977

ABSTRACT:
A multilayered electronic component that is easy to manufacture and that has excellent electrical characteristics includes end portions of coil wiring patterns that oppose a coil connection electrode that is displaced on the surface of a second ceramic layer due to an increase or decrease in the number of first ceramic layers. A coil connection electrode has a shape in which surface portions of second ceramic layers or opposed second ceramic layers having the first ceramic layers disposed in between are connected to the end portions of the coil wiring patterns that oppose the respective coil connection electrode, which are displaced due to the increase or decrease in the number of the first ceramic layers. A connection wiring pattern has a shape in which one portion of a coil connection electrode is connected to one portion of an external extension electrode connection pattern.

REFERENCES:
patent: 6115264 (2000-09-01), Nosaka
patent: 6218925 (2001-04-01), Iwao
patent: 6580350 (2003-06-01), Kobayashi
patent: 6618929 (2003-09-01), Kitamura
patent: 7211533 (2007-05-01), Kawada et al.
patent: 2003/0062111 (2003-04-01), Moriya
patent: 11-260644 (1999-09-01), None
patent: 2000-286125 (2000-10-01), None
patent: 2001-076928 (2001-03-01), None
patent: 2002-15918 (2002-01-01), None
patent: 2002-134321 (2002-05-01), None
patent: 2003-133174 (2003-05-01), None
Official Communication issued in the corresponding Chinese Application No. 200410100177.5, mailed on Mar. 10, 2006.
Official communication issued in the Japanese Application No. 2003-407266, mailed on Aug. 21, 2007.

Affiliated with

Also associated with

Rating

Multilayered electronic component does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayered electronic component, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayered electronic component will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2754236