Semiconductor device manufacturing: process – Semiconductor substrate dicing – With attachment to temporary support or carrier
Reexamination Certificate
2007-07-31
2007-07-31
Lebentritt, Michael (Department: 2812)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
With attachment to temporary support or carrier
Reexamination Certificate
active
11324220
ABSTRACT:
A multi-layered circuit substrate for a semiconductor device comprises a multi-layered circuit substrate body having first and second surfaces and comprising a plurality of conductive pattern layers integrally laminated one on the other from the first surface to the second surface, so that a plurality of semiconductor device elements can be arranged on the first surface of the substrate body; and a plate member, a rigidity thereof being higher than that of the substrate body, attached to the second surface of the substrate body. A plurality of semiconductor elements can be mounted on the semiconductor element mounting surface defined on the first surface of the substrate body.
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Iijima Takahiro
Rokugawa Akio
Lebentritt Michael
Shinko Electric Industries Co. Ltd.
Stevenson Andre′
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