Multilayered circuit board forming method and multilayered...

Details Multilayered circuit board forming method and multilayered... Multilayered circuit board forming method and multilayered...

2005-12-06

2005-12-06

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S830000, C029S846000, C156S233000, C156S247000

Reexamination Certificate

active

06971167

ABSTRACT:
A multilayered circuit board and a method of forming the multilayered circuit board are provided. In a first circuit forming process, a first circuit is formed on an insulating board with a conductor; in a circuit embedding process, the first circuit is embedded in the insulating board so as to have a predetermined surface flatness and a predetermined parallelism; in a masking process, a pilot hole for a via hole is masked at a part of a surface of the circuit; in an insulating layer forming process P5p, an insulating material is applied as a layer to the surface except that portion thereof covered by the mask; in an insulating material layer flattening process, the surface of the insulating material layer is flattened so as to have the predetermined surface flatness and the predetermined parallelism; and in a pilot hole forming process, the mask is removed.

REFERENCES:
patent: 3324014 (1967-06-01), Scott
patent: 4221047 (1980-09-01), Narken et al.
patent: 4354895 (1982-10-01), Ellis
patent: 4606787 (1986-08-01), Pelligrino
patent: 4789423 (1988-12-01), Pelligrino
patent: 4830691 (1989-05-01), Kida et al.
patent: 4915983 (1990-04-01), Lake et al.
patent: 4927477 (1990-05-01), Ellis
patent: 5114518 (1992-05-01), Hoffarth et al.
patent: 5199163 (1993-04-01), Ehrenberg et al.
patent: 5592737 (1997-01-01), Middelman et al.
patent: 10-335787 (1998-12-01), None

Affiliated with

Also associated with

Rating

Multilayered circuit board forming method and multilayered... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayered circuit board forming method and multilayered..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayered circuit board forming method and multilayered... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3492231