Multilayered circuit board

Details Multilayered circuit board Multilayered circuit board

2005-12-06

2005-12-06

Cuneo, Kamand (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S255000, C174S258000, C174S262000

Reexamination Certificate

active

06972383

ABSTRACT:
A multilayered circuit board has good imbedding properties for circuit patterns, and an interlayer insulating material having superior adhesive force and interlayer insulating properties. In a multilayered circuit board wherein interlayer connection is achieved by the contact of minute pointed protrusions, provided on a first conductive circuit layer, with a second conductive circuit layer, interlayer insulation is achieved by a film having a three-layer structure, comprising a thermoplastic film inserted between a pair of thermosetting adhesive layers.

REFERENCES:
patent: 5103293 (1992-04-01), Bonafino et al.
patent: 5457881 (1995-10-01), Schmidt
patent: 5822850 (1998-10-01), Odaira et al.
patent: 5865934 (1999-02-01), Yamamoto et al.
patent: 6452282 (2002-09-01), Kweon et al.
patent: 02000114280 (2000-04-01), None
Computer translation of Japanese Patent JP02000114280A.

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