Metal working – Method of mechanical manufacture – Electrical device making
Patent
1975-06-02
1977-04-05
Reynolds, Bruce A.
Metal working
Method of mechanical manufacture
Electrical device making
174 685, 174 94R, 339 17M, H05K 104
Patent
active
040153282
ABSTRACT:
A method of making a multilayered circuit assembly from a plurality of flat, flexible circuit elements, wherein each circuit element includes a substrate having conductive means to define an electrical path of travel which is formed between a base layer made of insulation material and a cover layer made of insulation material. Each circuit element has a connecting station associated with the conductive means. The method generally includes the steps of forming the conductive means on the base layer of each circuit element, punching a first opening through the conductive means and base layer at a connecting station of each circuit element, soldering the connecting station of each circuit element so that a solid solder pad fills the first opening whereby the solder electrically contacts the conductive means, punching a second opening through the cover layer of each circuit element, securing the cover layer of each circuit element over the base layer and conductive means so that the first opening is generally concentric with the second opening, punching a third opening in each circuit element through the solder pad, stacking a plurality of punched and soldered circuit elements on top of one another so that the third openings are generally concentric, inserting a terminal into the third openings of the stacked circuit elements so that a portion thereof contacts the solder, and staking the terminal so that the other surface thereof forms a cold weld interference fit against the solder.
REFERENCES:
patent: 1748952 (1930-03-01), Gookin
patent: 2990533 (1961-06-01), Hughes et al.
patent: 3171519 (1965-03-01), Nolte
patent: 3277347 (1966-10-01), Ecker
patent: 3292131 (1966-12-01), Porch
patent: 3446908 (1969-05-01), Tally et al.
patent: 3537176 (1970-11-01), Healy et al.
patent: 3728573 (1973-04-01), Roeber
LandOfFree
Multilayered circuit assembly including an eyelet for making wel does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Multilayered circuit assembly including an eyelet for making wel, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayered circuit assembly including an eyelet for making wel will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2259187