Multilayered ceramic substrate having solid non-porous metal con

Stock material or miscellaneous articles – Structurally defined web or sheet – Including aperture

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428209, 428210, 428332, 428426, 428432, 428433, 428901, 428212, 174 685, 361397, B32B 900

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048791563

ABSTRACT:
A multilayered ceramic (MLC) substrate having embedded and exposed conductors suitable for mounting and interconnecting a plurality of electronic devices exterior thereof. The horizontal planar conductors comprise substantially a plurality of solid, non-porous, homogeneous metal patterns, whereas the vertical interplanar connection conductors are substantially porous metal conductors that are formed by methods such as screening. The process to form the MLC substrate involves forming a pattern of solid, nonporous conductors to a backing sheet having a release layer, then transferring the pattern to a ceramic green sheet. Zero X-Y shrinkage sintering processes allow the MLC substrate and solid metal conductors to be densified without distortion of the solid metal patterns or the ceramic.

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patent: 4234367 (1980-11-01), Herron et al.
patent: 4301324 (1981-11-01), Kumar et al.
patent: 4642148 (1987-02-01), Kurihara et al.
patent: 4761325 (1988-08-01), Kurihara et al.
patent: 4766027 (1988-08-01), Burn
IBM Journal of R & D, MLC Manufacturing, Burger et al., vol. 27, No. 1, 1983, pp. 11-19.

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