Multilayered ceramic substrate and method of manufacturing the s

Details Multilayered ceramic substrate and method of manufacturing the s Multilayered ceramic substrate and method of manufacturing the s

1991-10-31

1993-10-12

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437184, 437189, 437211, 252518, H01L 2160

Patent

active

052525198

ABSTRACT:
A multilayered glass-ceramic substrate using copper as wiring material is fabricated by a step of forming wiring patterns with Au paste for connection of semiconductor chip prepared by adding at least one of Ni powder, Pt powder and Pd powder to Au powder, and copper oxide paste mainly composed of CuO powder, on a green sheet, and burning out the organic pattern by heat treatment in air, a step of reducing the copper oxide electrode by heat treatment in a reducing atmosphere containing hydrogen, and a step of sintering the substrate material, copper oxide electrode and gold electrode by heat treatment in nitrogen. Since the Au wiring pattern is formed on the top layer of the multilayered substrate in this constitution, wire bonding of high reliability is realized. Besides, by making use of the excellent solderability of Au, it may be also applied in flip-chip mounting of semiconductor. In addition, in this Au paste composition, the melting point of Au may be raised, and alloying or fusing is avoided if sintered at 900.degree. C. together with Cu electrode.

REFERENCES:
patent: 3969570 (1976-07-01), Smith
patent: 4004057 (1977-01-01), Hoffman et al.
patent: 4793946 (1988-12-01), Hsu
patent: 4795512 (1989-01-01), Nakatani et al.
patent: 4863683 (1989-09-01), Nakatani et al.
patent: 4865772 (1989-09-01), Suehiro et al.
patent: 4877555 (1989-10-01), Yuhaku et al.
patent: 4906404 (1990-03-01), Suehiro et al.

Affiliated with

Also associated with

Rating

Multilayered ceramic substrate and method of manufacturing the s does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayered ceramic substrate and method of manufacturing the s, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayered ceramic substrate and method of manufacturing the s will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1904276