Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2008-09-05
2010-02-02
Potter, Roy K (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C257S687000, C257SE23085
Reexamination Certificate
active
07656013
ABSTRACT:
There is provided a multilayer wiring substrate on which at least one semiconductor element is mounted. The multilayer wiring substrate includes: a baseboard; a first wiring layer formed on the baseboard and having a plurality of first wiring portions; an insulating layer formed on the baseboard; a second wiring layer formed on the insulating layer and having a plurality of second wiring portions, the second wiring portions being electrically connected to each other via a conductor wire, the conductor wire being arranged within the insulating layer three-dimensionally in a curved manner; and conductor portions configured to pass through the insulating layer and connecting the first wiring portions and the second wiring portions.
REFERENCES:
patent: 7080446 (2006-07-01), Baba et al.
patent: 08-078581 (1996-03-01), None
patent: 09-331133 (1997-12-01), None
patent: 09-331134 (1997-12-01), None
patent: 10-041435 (1998-02-01), None
patent: 2000-323516 (2000-11-01), None
Horiuchi Michio
Katagiri Fumimasa
Suganuma Shigeaki
Tokutake Yasue
Yoshiike Jun
Drinker Biddle & Reath LLP
Potter Roy K
Shinko Electric Industries Co. Ltd.
LandOfFree
Multilayer wiring substrate, method of manufacturing the... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Multilayer wiring substrate, method of manufacturing the..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer wiring substrate, method of manufacturing the... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4157473