Multilayer wiring substrate, method of manufacturing the...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Reexamination Certificate

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Details

C257S687000, C257SE23085

Reexamination Certificate

active

07656013

ABSTRACT:
There is provided a multilayer wiring substrate on which at least one semiconductor element is mounted. The multilayer wiring substrate includes: a baseboard; a first wiring layer formed on the baseboard and having a plurality of first wiring portions; an insulating layer formed on the baseboard; a second wiring layer formed on the insulating layer and having a plurality of second wiring portions, the second wiring portions being electrically connected to each other via a conductor wire, the conductor wire being arranged within the insulating layer three-dimensionally in a curved manner; and conductor portions configured to pass through the insulating layer and connecting the first wiring portions and the second wiring portions.

REFERENCES:
patent: 7080446 (2006-07-01), Baba et al.
patent: 08-078581 (1996-03-01), None
patent: 09-331133 (1997-12-01), None
patent: 09-331134 (1997-12-01), None
patent: 10-041435 (1998-02-01), None
patent: 2000-323516 (2000-11-01), None

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