Multilayer wiring substrate and production thereof

Details Multilayer wiring substrate and production thereof Multilayer wiring substrate and production thereof

1991-03-25

1993-05-04

LaRoche, Eugene R.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

257700, 257724, 257759, B44C 122, H01L 2348

Patent

active

052086569

ABSTRACT:
A multilayer wiring substrate having high reliability can be produced in good productivity by subjecting metal wiring layers to stabilization treatment on the surface with a metal such as Cr, Mo or the like or an aqueous solution of water glass so as to prevent generation of hillocks or whiskers and to improve chemical resistance.

REFERENCES:
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patent: 3985597 (1976-10-01), Zielinski
patent: 4386116 (1983-05-01), Nair et al.
patent: 4463059 (1984-07-01), Bhattacharya et al.
patent: 4523372 (1985-06-01), Balda et al.
patent: 4525383 (1985-06-01), Saito
patent: 4531144 (1985-07-01), Holmberg
patent: 4556897 (1985-12-01), Yorikane et al.
patent: 4659427 (1987-04-01), Barry et al.
patent: 4786360 (1988-11-01), Cote et al.
patent: 5021869 (1991-06-01), Kaw
patent: 5040049 (1991-08-01), Raaijnakers

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