Multilayer wiring substrate, and method of producing same

Details Multilayer wiring substrate, and method of producing same Multilayer wiring substrate, and method of producing same

2007-06-19

2007-06-19

Everhart, Caridad (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

C257SE23003, C257S700000

Reexamination Certificate

active

11411020

ABSTRACT:
A method of producing a multilayer wiring substrate is disclosed. The multilayer wiring substrate is free from a core substrate and includes a build up layer which includes an insulator layer and a wiring layer. One of a first main surface and a second main surface of the build up layer is formed with a metal supporting frame body. The method includes the steps of: forming a first insulator layer on a first main surface of a metal supporting plate, where the first insulator layer is included in the insulator layer and becomes a first resist layer which is positioned on the first main surface's side of the build up layer, and forming a first metal pad layer in a given position on a first main surface of the first insulator layer, where the first metal pad layer is included in the wiring layer and becomes a metal pad layer.

REFERENCES:
patent: 4780957 (1988-11-01), Shiga et al.
patent: 5386627 (1995-02-01), Booth et al.
patent: 5527741 (1996-06-01), Cole et al.
patent: 5918153 (1999-06-01), Morgan
patent: 6221693 (2001-04-01), Ho
patent: 6331447 (2001-12-01), Ho
patent: 6399891 (2002-06-01), Kurita et al.
patent: 2001/0013425 (2001-08-01), Rokugawa et al.
patent: 2002/0001937 (2002-01-01), Kikuchi et al.
patent: 2003/0161129 (2003-08-01), Kusano et al.
patent: 1 065 717 (2001-01-01), None
patent: 1 091 406 (2001-04-01), None
patent: 1091406 (2001-11-01), None
patent: 11-233937 (1999-08-01), None
patent: 11-289025 (1999-10-01), None
patent: 2000-323613 (2000-11-01), None
patent: 2001-177010 (2001-06-01), None
patent: 2002-26171 (2002-01-01), None
patent: 485746 (2002-05-01), None

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