Multilayer wiring substrate and method for producing the same

Details Multilayer wiring substrate and method for producing the same Multilayer wiring substrate and method for producing the same

1998-09-11

2000-12-12

Lam, Cathy F.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428901, 174258, 174259, 174262, 361736, 361750, 361795, B32B 300

Patent

active

061595861

ABSTRACT:
The present invention relates to a multilayer wiring substrate for mounting a semiconductor chip, etc. The multilayer wiring substrate is comprised of a plurality of double-sided circuit substrates, each comprised of an organic high molecular weight insulating layer and wiring conductor. An adhesive is used for laminating the double-sided circuit substrates. A Ni--Fe based alloy foil or a titanium foil is embedded within the organic high molecular weight insulating layer.

REFERENCES:
patent: 3795047 (1974-03-01), Abolafia et al.
patent: 4648179 (1987-03-01), Bhattacharyya et al.
patent: 5374469 (1994-12-01), Hino et al.
patent: 5768108 (1998-06-01), Miura et al.
patent: 5876842 (1999-03-01), Duffy et al.

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