Multilayer wiring substrate

Details Multilayer wiring substrate Multilayer wiring substrate

2008-03-12

2009-08-18

Gilman, Alexander (Department: 2833)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

Reexamination Certificate

active

07575442

ABSTRACT:
A first wiring pattern formed on a first layer of a multilayer wiring substrate, a second wiring pattern formed on a layer different from the first layer on which the first wiring pattern is formed, a penetration hole penetrating the front surface and the back surface of the substrate, and a penetration hole penetrating a front surface and a back surface of the substrate; and a fitting connector having a conductor part on a side surface inscribed in the penetration hole and fitting into the penetration hole are provided. The first wiring pattern and the second wiring pattern are exposed from the internal surface of the penetration hole, and the fitting connector connects a first end part of the conductor part and a second end part with an exposed part of the first wiring pattern and an exposed part of the second wiring pattern, respectively.

REFERENCES:
patent: 7263769 (2007-09-01), Morimoto et al.
patent: 7342183 (2008-03-01), Egitto et al.
patent: 2004/0195002 (2004-10-01), Higuchi et al.
patent: 2006/0102386 (2006-05-01), Morimoto et al.
patent: 2008/0017409 (2008-01-01), Takeuchi et al.
patent: 2006-140365 (2006-06-01), None

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