Multilayer wiring substrate

Details Multilayer wiring substrate Multilayer wiring substrate

1986-11-05

1988-05-10

Swisher, Nancy A. B.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428901, 428426, 428431, 428432, 428435, 174 685, B32B 300, B32B 1706, B32B 900, B32B 1500

Patent

active

047434899

ABSTRACT:
A multilayer wiring substrate for mounting a plurality of electronic circuit elements wherein individual wiring layers are separately by insulating layers of an organic material. A plurality of contact pads are formed on the uppermost insulating layer and are connected to wiring members by pressure bonding at least one ceramic buffer member is provided beneath the contact pads to prevent pressure applied during bonding from affecting the wiring layers.

REFERENCES:
patent: 4578304 (1986-03-01), Hamaguchi
"A Comparison of Thin Film, Thick Film, and Co-Fired High Density Ceramic Multilayer with the Combined Technology: T&T HDCM", Dr. M. Terasawa et al., The International Journal for Hybrid Microelectronics, vol. 6, No. 1, Oct. 1983.

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