Multilayer wiring substrate

Details Multilayer wiring substrate Multilayer wiring substrate

1985-08-23

1987-08-04

Grimley, Arthur T.

Electricity: electrical systems and devices

Miscellaneous

29829, 29831, 174 685, 361397, 361412, H05K 114

Patent

active

046850333

ABSTRACT:
A multilayer wiring substrate is described wherein a plurality of power supply wiring layers for supplying different voltages is arranged in a first group and interlayered with insulation layers and an additional plurality of power supply wiring layers arranged in a second group, each for providing the same voltage as a layer in the first group, is disposed within the same substrate and interlayered with insulation layers. Corresponding wiring layers of the first and second group are interconnected with via-hole wirings. A signal wiring section is disposed on the power supply wiring section. Polyimide layers of insulation separate the wiring layers of the signal wiring section and via-hole wirings include a mixture of gold and polyimide.

REFERENCES:
patent: 3568000 (1971-03-01), D'Aboville
patent: 4237522 (1980-12-01), Thompson
patent: 4245273 (1981-01-01), Feinberg et al.
patent: 4302625 (1981-11-01), Hetherington et al.
patent: 4328531 (1982-04-01), Nagashima et al.
patent: 4353040 (1982-10-01), Krumm et al.
patent: 4450029 (1984-04-01), Holbert et al.
patent: 4498122 (1985-02-01), Rainal

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