Multilayer wiring substrate

Details Multilayer wiring substrate Multilayer wiring substrate

1990-02-16

1991-04-30

Tolin, Gerald P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174 32, 333 1, 333238, 361414, H01B 734, H05K 720

Patent

active

050120476

ABSTRACT:
A multilayer wiring substrate which includes a plurality of laminated wiring layers, a plurality of insulating layers for providing insulation between the wiring layers, and a plurality of hollows provided within at least one of the insulating layers.

REFERENCES:
patent: 2721312 (1955-10-01), Grieg
patent: 2919441 (1959-11-01), Chu
patent: 2952579 (1960-09-01), Merriman
patent: 3575674 (1971-04-01), Howe, Jr.
patent: 3581243 (1971-05-01), Alford
patent: 3700825 (1972-10-01), Taplin et al.
patent: 3777221 (1973-12-01), Tatsuko et al.
patent: 3834960 (1974-09-01), Prentcie et al.
patent: 4234367 (1980-11-01), Herron et al.
patent: 4245273 (1981-01-01), Feinberg et al.
patent: 4322778 (1982-03-01), Barbour
patent: 4640866 (1987-02-01), Suzuki, II
patent: 4649228 (1987-03-01), Suzuki
patent: 4721831 (1988-01-01), Vaora
patent: 4734315 (1988-03-01), Bate
patent: 4766671 (1988-08-01), Utsumi et al.
patent: 4774630 (1988-09-01), Reisman et al.
Hexcel Products Inc., Reinforced Plastic Honeycomb in Electronic Circuit Sandwich, Technical Service Bull., California, 1959.

Affiliated with

Also associated with

Rating

Multilayer wiring substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer wiring substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer wiring substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-641976