Multilayer wiring substrate

Details Multilayer wiring substrate Multilayer wiring substrate

1984-12-06

1986-03-25

Lesmes, George F.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428901, 428660, 428666, 428671, 428670, 156297, B32B 1500, B32B 300, C25D 510, C25D 528

Patent

active

045783047

ABSTRACT:
A multilayer wiring substrate composed of organic dielectric layers with wiring layers disposed therein supports large-scale integrated circuit chips and bonding pads. To prevent damage to the wiring layers when wires from the integrated circuit chips are attached to the bonding pads by thermocompression bonding, a metallic layer is interposed between the wiring layers and the bonding pads.

REFERENCES:
patent: 3381256 (1968-04-01), Schuller et al.
patent: 4016050 (1977-04-01), Lesh et al.
patent: 4190474 (1980-02-01), Berdan et al.
patent: 4260449 (1981-04-01), Berdan et al.
patent: 4311768 (1982-01-01), Berdan et al.
Fraser et al., IBM Tech Discl. 3020, vol. 15, No. 10, 3/73.
"A Comparison of Thin Film, Thick Film, and Co-Fired High Density Ceramic Multilayer with the Combined Technology: T&T HDCM (Thin Film and Thick Film High Density Ceramic Module)", Dr. M. Terasawa et al., The International Journal for Hybrid Microelectronics, vol. 6, No. 1, Oct. 1983, pp. 607-615.

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