Multilayer wiring structure, semiconductor device, pattern...

Details Multilayer wiring structure, semiconductor device, pattern... Multilayer wiring structure, semiconductor device, pattern...

2011-08-16

2011-08-16

Wagner, Jenny L. (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257SE23070, C174S261000

Reexamination Certificate

active

07999392

ABSTRACT:
A multilayer interconnection structure according to this invention is applied to a case where a plurality of interconnections are formed at a fine pitch and a via is connected to at least one of the interconnections. In the multilayer interconnection structure, a region facing the via is locally narrowed in at least the interconnection, facing the via, of the interconnections adjacent to the interconnection connected to the via.

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