Multilayer wiring structure for attaining high-speed signal prop

Details Multilayer wiring structure for attaining high-speed signal prop Multilayer wiring structure for attaining high-speed signal prop

1995-07-25

1997-05-27

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

333243, 333246, 333161, 174262, 361805, 361794, H05K 102

Patent

active

056334796

ABSTRACT:
Signal wiring layers are formed between a power supply layer and a ground layer, which have conductor patterns each constituted by a plurality of parallel strip-shaped conductors. The above layers are isolated from each other by insulating layers. The signal wiring layer has wires which are arranged in parallel with the parallel strip-shaped conductors of the conductor pattern of the power supply layer, and the signal wiring layer has wires which are arranged in parallel with the parallel strip-shaped conductors of the conductor pattern of the ground layer.

REFERENCES:
patent: 3876822 (1975-04-01), Davy et al.
patent: 4054939 (1977-10-01), Ammon
patent: 5136123 (1992-08-01), Kobayashi et al.

Affiliated with

Also associated with

Rating

Multilayer wiring structure for attaining high-speed signal prop does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer wiring structure for attaining high-speed signal prop, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer wiring structure for attaining high-speed signal prop will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2330879