Multilayer wiring structure

Details Multilayer wiring structure Multilayer wiring structure

1982-02-08

1984-01-17

Grimley, A. T.

Electricity: conductors and insulators

Conduits, cables or conductors

Combined

174117PC, 361410, 361416, H05K 114, H05K 116, H01R 402

Patent

active

044265484

ABSTRACT:
A multilayer wiring structure comprising a plurality of groups of patterns each having a multiplicity of wirings formed on the opposite sides of an intervening insulation film. The intervening insulation film is formed with a void exposed to both an upper pattern of a multiplicity of wirings and a lower pattern of a multiplicity of wirings, the upper and lower patterns being formed on and beneath the intervening insulation film and arranged to form a matrix. The void extends longitudinally across one of the patterns, and the upper and lower patterns are connected together through the void at crossing points of the matrix.

REFERENCES:
patent: 782391 (1905-02-01), Hanson
patent: 2558008 (1951-06-01), Smith
patent: 3499098 (1970-03-01), McGahey
patent: 3725744 (1973-04-01), Reed
patent: 3824433 (1974-07-01), Newton
Breuninger; K. et al.; Printed Circuit Crossovers by a Thin-Film-Thick-Film Technique; Feinwerk Technik & Mess Technik; vol. 84, No. 7, pp. 321-322; Oct.-Nov. 1976.

Affiliated with

Also associated with

Rating

Multilayer wiring structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer wiring structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer wiring structure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-701709