Multilayer wiring board, manufacturing method therefor and...

Details Multilayer wiring board, manufacturing method therefor and... Multilayer wiring board, manufacturing method therefor and...

2007-10-23

2007-10-23

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S592100, C029S825000, C029S830000, C029S832000

Reexamination Certificate

active

11184827

ABSTRACT:
A built-in component type multilayer wiring board includes at least one resin layer and at least one frame resin layer. The resin layer includes electronic components buried therein. The frame resin layer includes at least one of glass cloth, filler and nonwoven fabric. The frame resin layer includes no electronic component.

REFERENCES:
patent: 4443278 (1984-04-01), Zingher
patent: 4578279 (1986-03-01), Zingher
patent: 4803115 (1989-02-01), Fushiki et al.
patent: 6021050 (2000-02-01), Ehman et al.
patent: 6038133 (2000-03-01), Nakatani
patent: 6338767 (2002-01-01), Nakatani et al.
patent: 6370013 (2002-04-01), Lino et al.
patent: 6469374 (2002-10-01), Imoto
patent: 6524717 (2003-02-01), Takano et al.
patent: 6552265 (2003-04-01), Bergstdt et al.
patent: 6625307 (2003-09-01), Kanungo et al.
patent: 2002/0175402 (2002-11-01), McCormack et al.
patent: 2003/0055970 (2003-03-01), Kourtidis
patent: 2004/0088416 (2004-05-01), Nakatani et al.
patent: 04-018787 (1992-01-01), None
patent: 404122641 (1992-04-01), None
patent: 408118543 (1996-05-01), None
patent: 10119195 (1998-05-01), None
patent: 11-220262 (1999-08-01), None
patent: 2000117733 (2000-04-01), None
patent: 2000216512 (2000-08-01), None
patent: 2001-44641 (2001-02-01), None
patent: 2001-053413 (2001-02-01), None
patent: 2001-119147 (2001-04-01), None
patent: 2001-210955 (2001-08-01), None
patent: 2001-244368 (2001-09-01), None
Office Action dated May 15, 2007 issued in corresponding Japanese Patent Application No. 2002-047979.

Affiliated with

Also associated with

Rating

Multilayer wiring board, manufacturing method therefor and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer wiring board, manufacturing method therefor and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer wiring board, manufacturing method therefor and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3851236