Multilayer wiring board, manufacturing method therefor and...

Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – With rotor

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C324S754090

Reexamination Certificate

active

07091716

ABSTRACT:
A built-in component type multilayer wiring board includes at least one resin layer and at least one frame resin layer. The resin layer includes electronic components buried therein. The frame resin layer includes at least one of glass cloth, filler and nonwoven fabric. The frame resin layer includes no electronic component.

REFERENCES:
patent: 3917984 (1975-11-01), Kong et al.
patent: 4803115 (1989-02-01), Fushiki et al.
patent: 4891789 (1990-01-01), Quattrini et al.
patent: 5407557 (1995-04-01), Iida et al.
patent: 5821614 (1998-10-01), Hashimoto et al.
patent: 6021050 (2000-02-01), Ehman et al.
patent: 6038133 (2000-03-01), Nakatani
patent: 6215321 (2001-04-01), Nakata
patent: 6338767 (2002-01-01), Nakatani
patent: 6370013 (2002-04-01), Lino
patent: 6414504 (2002-07-01), Johnston
patent: 6429673 (2002-08-01), Obata et al.
patent: 6452410 (2002-09-01), Parker
patent: 6469374 (2002-10-01), Imoto
patent: 6524717 (2003-02-01), Takano et al.
patent: 6552265 (2003-04-01), Bergstedt et al.
patent: 6625307 (2003-09-01), Kanungo
patent: 2002/0175402 (2002-11-01), McCormack et al.
patent: 2003/0055970 (2003-03-01), Kourtidis
patent: 2004/0088416 (2004-05-01), Nakatani et al.
patent: 404122641 (1992-04-01), None
patent: 408118543 (1996-05-01), None
patent: 10119195 (1998-05-01), None
patent: 11-220262 (1999-08-01), None
patent: 2000117733 (2000-04-01), None
patent: 2000216512 (2000-08-01), None
patent: 2001-44641 (2001-02-01), None
patent: 2001-053413 (2001-02-01), None
patent: 2001-119147 (2001-04-01), None
patent: 2001-210955 (2001-08-01), None
patent: 2001-244368 (2001-09-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Multilayer wiring board, manufacturing method therefor and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer wiring board, manufacturing method therefor and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer wiring board, manufacturing method therefor and... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3633895

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.