Multilayer wiring board laminate with enhanced thermal dissipati

Details Multilayer wiring board laminate with enhanced thermal dissipati Multilayer wiring board laminate with enhanced thermal dissipati

1997-09-29

1999-06-29

Kincaid, Kristine

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174255, H05K 103

Patent

active

059171570

ABSTRACT:
A strongly adherent laminate with enhanced thermal conductivity and high dielectric strength. The preferred embodiment includes an aluminum-surfaced substrate, a copper layer adjacent the aluminum oxide layer, and optionally, a tin/silver layer adjacent the copper deposition layer, forming a base substrate laminate for mounting a multilayer wiring board laminate to has been discovered. Another embodiment includes a metallic-surfaced substrate, an adjacent vapor-deposited dielectric layer, a metallic conductor layer adjacent the dielectric layer, and optionally, a solder layer adjacent the metallic conductor layer. Surprisingly, such construction has been demonstrated to have a self-healing dielectric whereby dielectric breakdown strength is maintained in repeated tests. Such laminates will find utility in the electronics industry in the fabrication of printed circuit boards and afford a combination of high adhesion, thermal conductivity, and dielectric strength heretofore unknown in the industry.

REFERENCES:
patent: 4882454 (1989-11-01), Peterson et al.
patent: 4963697 (1990-10-01), Peterson et al.
patent: 5258887 (1993-11-01), Fortune
patent: 5321210 (1994-06-01), Kimbara et al.
patent: 5347091 (1994-09-01), Schroeder

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