Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1993-05-28
1994-01-25
Picard, Leo P.
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
174264, 361785, H05U 100
Patent
active
052817717
ABSTRACT:
An interlevel connector, a multilayer wiring board assembly, and method for making the same are presented. The interlevel connector includes a dielectric substrate having a plurality of through holes and a corresponding plurality of pultrusions. Each pultrusion includes a plurality of electrically conductive fibers and an electrically conductive or insulating host material carrying the plurality of fibers, each of the plurality of pultrusions being located in a respective through hole and having fibrillated portions extending from surfaces of the dielectric substrate. The interlevel connector is used in the construction of a multilayer wiring assembly in which first and second wiring boards having respective conductive portions are interconnected. The interlevel connector is located adjacent and between the first and second wiring boards, whereby the fibrillated portions of the pultrusion extending from the surfaces of the dielectric substrate contact the conductive portions of the first and second wiring boards. The wiring boards can be permanently or removably locatable adjacent the dielectric substrate.
REFERENCES:
patent: 4170677 (1979-10-01), Hutcheson
patent: 4295700 (1981-10-01), Sado
patent: 4358699 (1982-11-01), Wilsdorf
patent: 4408814 (1983-10-01), Takashi et al.
patent: 4449774 (1984-05-01), Takashi et al.
patent: 4584456 (1986-04-01), Oodaira et al.
patent: 4641949 (1987-02-01), Wallace et al.
patent: 4642889 (1987-02-01), Grabbe
patent: 4664971 (1987-05-01), Soens
patent: 4694138 (1987-09-01), Oodaira et al.
patent: 4841099 (1989-06-01), Epstein et al.
patent: 4912288 (1990-03-01), Atkinson et al.
patent: 4967314 (1990-10-01), Higgins, III
patent: 4970553 (1990-11-01), Orlowski et al.
patent: 4988306 (1991-01-01), Hopfer, III et al.
patent: 5003693 (1991-04-01), Atkinson et al.
The American Heritage Dictionary, Second College Edition, Houghton Mifflin Company, 1982, p,. 500.
Maccorquodale, "Button Connectors--Solaerless, Low-Thermal Rise Interconnect For High-Speed Signal Transmission", Connection Technology, Jan. 1990, pp. 25-28.
Swift Joseph A.
Wallace Stanley J.
Figlin Cheryl R.
Picard Leo P.
Xerox Corporation
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